Laser Micromachining Services

Hi-Nano specializes in delivering cutting-edge solutions for challenging high-precision machining needs across a wide range of materials. Our state-of-the-art technology and expert team are dedicated to providing exceptional results for our customers.

Materials Expertise & Applications

Explore our job shop’s diverse services covering various materials and applications, conveniently categorized. Contact us if you need assistance – we’re here to help with pleasure.

Optical Glass

Silicon & SiC

Ceramics

Diamonds

Lithium Niobate (LN)

Polymers and PI

Thin Metals

Advanced Materials

Precision Laser Micromachining for Silicon Wafer

We excel in providing job shop services for Silicon wafers and SiC, addressing the challenges that conventional diamond saw machining methods often struggle to overcome.

Our commitment to precision and advanced technology ensures that we meet the specialized requirements of the semiconductor and electronics industries. Count on HI-Nano for your job shop services needs, and let us help you achieve remarkable results in silicon and SiC micromachining.

Applications:

  • Wafer downsizing
  • Low-k wafer dicing
  • Ultra-thin wafer dicing
  • Micro mirror array wafer dicing
  • MEMS wafer with moving parts
  • Nano structured optical wafers
  • Taiko ring wafer dicing
  • Muti-project wafer selective dicing
  • Gpp Round dice power devices dicing
  • Raised dots wafer machining

Laser machining for SiC ( Silicon Carbide )

SiC, a key material for next-generation semiconductors, boasts hardness just below diamond, making it extremely challenging to machine. In response, Hi-Nano has pioneered laser machining solutions tailored for SiC  wafers, covering tasks like:

Ingot Slicing,  Freeform Dicing,  Hole Drilling,  Grooving,  Surface Texturing, and more.

Additionally, Hi-Nano excels in machining thick sintered SiC to create essential tools and machine parts for semiconductor manufacturing equipment, including precision components like SiC wafer chuck tables, focus rings, and wafer carriers.

Notably, Hi-Nano’s approach exclusively relies on laser non-contact processes, eliminating tool wear issues. This unique attribute makes it ideal for applications requiring the precise drilling of numerous tiny holes, such as in SiC shower heads.