Laser Micromachining Services
Hi-Nano specializes in delivering cutting-edge solutions for challenging high-precision machining needs across a wide range of materials. Our state-of-the-art technology and expert team are dedicated to providing exceptional results for our customers.
Major Markets:
- Semiconductor Industry : Enabling advanced 2.5D and 3D packaging.
- Telecommunications : TGV is crucial for high-performance components in telecommunications, supporting the demand for low-loss, faster and more reliable communication devices.
Custom Jobshop Services:
We provide custom jobshop services to meet the unique needs of our clients. Whether you require prototype development or large-scale production, our team is ready to deliver excellence.
Applications:
- Ultra-thin ( 25um) glass cutting
- Thick-glass (10mm)cutting
- Spiral Glass cutting
- 10 mm thick glass chuck
- cutting and grooving
- Glass joining and polishing
- Capping bio-glass selective slimming.
Applications:
- Band-Pass Filters
- Optical Sensors
- Micro Lens Array
- Lidar (Light Detection and Ranging)
- Anti-Reflect Lens
- Protective Windows
- Dichroic Filters
- Beam Splitters
- Polarizing Filters
- Dielectric Mirrors
- IR (Infrared) Windows
- UV (Ultraviolet) Filters
- Gradient Index (GRIN) Lenses
- Sapphire Lenses
- Diamond Lenses