Laser Micromachining Services

Hi-Nano specializes in delivering cutting-edge solutions for challenging high-precision machining needs across a wide range of materials. Our state-of-the-art technology and expert team are dedicated to providing exceptional results for our customers.

Materials Expertise & Applications

Explore our job shop’s diverse services covering various materials and applications, conveniently categorized. Contact us if you need assistance – we’re here to help with pleasure.

Optical Glass

Silicon & SiC



Lithium Niobate (LN)

Polymers and PI

Thin Metals

Advanced Materials

TGV / Glass Core

We offer customized TGV and Glass Core Job Shop Services

Through-Glass-Vias (TGV) technology involves creating microscopic vias through glass substrates, enabling intricate three-dimensional connections in microelectronic devices.
This breakthrough technology has found applications across various industries due to its unique advantages.


  • High-Density Interconnections
  • Reduced signal losses
  • Improved Thermal Management

Major Markets:

  • Semiconductor Industry : Enabling advanced 2.5D and 3D packaging.
  • Telecommunications : TGV is crucial for high-performance components in telecommunications, supporting the demand for low-loss, faster and more reliable communication devices.

Our Technology Features : Hole diameter: > 10um

  • Aspect ratio: 1:20
  • Straight side wall
  • No chipping and microcracks
  • High accuracy

Versatility in Applications:

Our TGV technology is not just a solution; it's a versatile tool for various applications. From semiconductor packaging to medical devices and beyond, our TGV capabilities cater to a wide range of industries.

Custom Jobshop Services:

We provide custom jobshop services to meet the unique needs of our clients. Whether you require prototype development or large-scale production, our team is ready to deliver excellence.

Connect with Us:

Contact us today to experience how our innovative solutions and job shop services can propel you to success.

AR/VR/MR Lenses

Given the presence of nanostructured optic devices on the wafer, a high-cleanliness environment is imperative. The entire process is meticulously executed within a Class 1000 cleanroom to ensure that all sensitive components remain uncontaminated, free from dust or any inadvertent contact.


  • Capable of cutting both straight lines and free shapes with precision.
  • Accommodates a wide range of glass thicknesses, from ultra-thin and bendable to ultra-thick glass.
  • Enables cutting and drilling of various optical glass types with exceptional accuracy.
  • Delivers high cutting quality for coated lenses, ensuring superior results.
  • Cutting of AR/VR/MR lenses
  • Dicing of optical gratings
  • Dicing of optical waveguides
  • Dicing of MEMS Micro Lens Array
  • Dicing of Lidar optics
  • Dicing of high-precision optical encoders
  • Micro marking of Reticles lens.
  • Dicing of Meta Optical Elements
  • Dicing of Photo Mask

Glass Wafers

At Hi-Nano, we have the expertise to provide a wide range of glass wafers, each tailored to unique applications. Our offerings include glass spacers, glass carrier wafers, glass interposers, micro and nano-structured glass wafers, and glass capping wafers. We also supply TGV (Through Glass Vias) glass substrates, catering to the semiconductor industry and high-frequency telecommunications. These wafers are essential for advanced IC packages, enabling 2.5D and 3D packaging solutions. Trust Hi-Nano for your glass wafer needs, designed to meet the demands of cutting-edge technology

Application examples:

  1. Glass interposer, spacer and carrier wafers.
  2. Wafer-Level Packaging.
  3. Wafer-Level Optics.
  4. Micro & nano structured glass wafers.
  5. Photonic Integrated Circuits (PICs).
  6. Waveguides and splitters.
  7. Glass wafers for High-Frequency Devices substrate.
  8. Glass wafers for Lab-on-a-chip devices.
  9. AR/VR/ MR glass wafers.
  10. Glass wafer for MEMS based sensors.
  11. Glass wafer for RF filters.

These examples illustrate the versatility of glass wafers across a range of industries, from semiconductor manufacturing to medical diagnostics and consumer electronics. HI-Nano’s capabilities in providing various types of glass wafers support innovation and technology advancements in these fields.

General Optical Glass

At HI-Nano, we harness the power of the latest laser technology to precision machine various types of optical glass. Our capabilities span the entire spectrum, from ultra-thin to ultra-thick glass, and from linear to freeform shapes. Our non-contact machining methods include cutting, hole drilling, grooving, selective thinning, glass inner marking, polishing, welding, and more. The beauty of our approach lies in its ability to deliver contamination-free results. This makes our services especially suited for critical applications in semiconductor, optics, medical, sensors, and military industries


  • Ultra-thin ( 25um) glass cutting
  • Thick-glass (10mm)cutting
  • Spiral Glass cutting
  • 10 mm thick glass chuck
  • cutting and grooving
  • Glass joining and polishing
  • Capping bio-glass selective slimming.

Coated Glass Wafer

Dealing with coated glass, especially when it’s equipped with multilayers of materials, can be a challenging task. Traditional machining methods, whether mechanical or laser-based, often risk damaging the delicate coating layers. HI-Nano, however, has developed an innovative process that allows us to machine sensitive lenses without causing any damage to the lenses or sensors. This breakthrough technique is particularly beneficial for high-value optical lenses, sensors, and devices, ensuring the integrity of your coated glass products.


  • Band-Pass Filters
  • Optical Sensors
  • Micro Lens Array
  • Lidar (Light Detection and Ranging)
  • Anti-Reflect Lens
  • Protective Windows
  • Dichroic Filters
  • Beam Splitters
  • Polarizing Filters
  • Dielectric Mirrors
  • IR (Infrared) Windows
  • UV (Ultraviolet) Filters
  • Gradient Index (GRIN) Lenses
  • Sapphire Lenses
  • Diamond Lenses