Laser Micromachining Services

Hi-Nano specializes in delivering cutting-edge solutions for challenging high-precision machining needs across a wide range of materials. Our state-of-the-art technology and expert team are dedicated to providing exceptional results for our customers.

Materials Expertise & Applications

Explore our job shop’s diverse services covering various materials and applications, conveniently categorized. Contact us if you need assistance – we’re here to help with pleasure.

Optical Glass

Silicon & SiC



Lithium Niobate (LN)

Polymers and PI

Thin Metals

Advanced Materials

Polymers and PI

Hi-Nano uses versatile laser systems for precise processing of polyimide (PI) and similar flexible materials in microelectronics, FPCBs, RDL, and IC probe card isolation layers. These systems perform tasks like free-shape cutting and micro-hole drilling without heat-affected zones.

Laser processing typically follows electronic component mounting, often with other substrates. Polyimides, commonly in thin, flexible circuit boards, also serve in energy storage and alternative energy insulation.

Their exceptional properties, including resistance to extreme temperatures (-256° to 400°C), make them widely used in aerospace. Kapton films, a type of polyimide, can be laminated, metallized, or coated with adhesives.