Hi-Nano uses versatile laser systems for precise processing of polyimide (PI) and similar flexible materials in microelectronics, FPCBs, RDL, and IC probe card isolation layers. These systems perform tasks like free-shape cutting and micro-hole drilling without heat-affected zones.

Laser processing typically follows electronic component mounting, often with other substrates. Polyimides, commonly in thin, flexible circuit boards, also serve in energy storage and alternative energy insulation.

Their exceptional properties, including resistance to extreme temperatures (-256° to 400°C), make them widely used in aerospace. Kapton films, a type of polyimide, can be laminated, metallized, or coated with adhesives.