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2023 Hi Nano’s innovative technologies
March 11, 2024
Posted by
hinanomms
11
Mar
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Our Team
Our Vision
Our Goal
Our ESG commitment
Technologies
Advanced AR Lens Cutting
Glass cutting and hole drilling
TGV (Through Glass Vias) and Glass Core
Coated Lens Cutting
Sintered SiC Machining
SiC wafer dicing
Ceramic Micromachining
IC Vertical Probe Card
Laser Wafer Dicing
Diamond Laser Processing
Service
Optical Glass
TGV-Glass Core
AR/VR/MR Lenses
Glass Wafers
General Optical Glass
Coated Glass Wafer
Silicon wafers / SiC
Siliconwafers
SiC (Silicon Carbide)
Ceramics
CVD Diamonds
LN(Lithium Niobate)
Polymers and PI
Thin Metals
Advanced Materials
Showcase
Products
Tailored Laser Systems
FMM Laser Repair System
Laser Dicer and Engraver
Sapphire Laser dicer
Glass Laser Separator
USP Laser Glass Dicer
LTCC Laser Drilling System
7392 Glass Cutting System
MicroVia-1000
UF-300S Production Line
AR-200A AR Wafer Laser Dicer
WS-1 FSL Work Station
News & Events
CONTACT US
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