Dicing of optical glass wafer

Our “Perfect Cleave” laser technology achieves:

• Zero kerf width
• No HAZ
• Chipping size < 20 um and clear cut
• No particle formation

Applications: Optical glass wafer dicing.

Customized Carrier Wafers / Wafer Chucks

Materials:

Sapphire, quartz, glass, ceramics and silicon nitride.

Sizes:

2” ~ 12”

Multilayer structure possible.
Chemical resistant.

Applications: Wafer support, transportation and holding during processing.

Structured Glass Wafers / substrates

Hi-Nano provides custom structured glass wafers and substrates for MEMS, Image sensor packaging and other applications.

Applications: MEMS, LED, Lab-on-a-Chip. Micro Fluidics.