Hi-Nano provides high quality customized glass spacer wafers (round, square and other geometric holes) for 3D WLP and MEMS manufacturers.
Applications: WLP of CMOS imaging sensor and MEMS.
Achieve no contact, no contamination, no discoloration and high precision full cut using the latest laser technology. (Average chipping size < 10 um)
Applications: MOEMS, MEMS and WL Optical glass wafer dicing.
