Hi-Nano Micromachining Services

Glass Cutting Laser System

Hi-Nano’s “Perfect Cleave” laser cutting system.With zero kerf width cutting Clients can achieve their highest cutting speed and quality to date.

  • Vertical sidewall
  • No Heat Affected Zone (HAZ)
  • Minimal Chipping (< 10 um)
  • Ultra-High Precision (+/-1 um)
  • Surface roughness
    (Ra <1um)
  • Reduced post processing times
  • Extremely high productivity rate
  • High yield
  • Designed for 24/7 mass production operation
  • Cover glass cutting for smart phones
  • Cover glass for mobile devices
  • Wearable electronic device screens
  • Optical lenses
  • Optical filters
  • Dicing glass wafers
  • Strengthened and non-strengthened glass cutting
  • Ultra-thin glass cutting