Glass Cutting Laser System
Hi-Nano’s “Perfect Cleave” laser cutting system.With zero kerf width cutting Clients can achieve their highest cutting speed and quality to date.
Features：
- Vertical sidewall
- No Heat Affected Zone (HAZ)
- Minimal Chipping (< 10 um)
- Ultra-High Precision (+/-1 um)
- Surface roughness
(Ra <1um)
- Reduced post processing times
- Extremely high productivity rate
- High yield
- Designed for 24/7 mass production operation
Applications：
- Cover glass cutting for smart phones
- Cover glass for mobile devices
- Wearable electronic device screens
- Optical lenses
- Optical filters
- Dicing glass wafers
- Strengthened and non-strengthened glass cutting
- Ultra-thin glass cutting
