High-Speed Ceramic Laser Drilling Machine
(50 holes/Sec~400 holes/Sec, Production Increase)
Features：
- Utilizing the Latest Laser Technology
- Variety of materials, Alumina, Aluminum, Nitride, Si3N4, High speed substrate drilling
- Micro-drilling<Dia. 0.07 mm @ 50 holes/second, Though Holes (VIA) more than 400/Second(Green sheet)
- Storage for over 100 sets of parameters
- Operator friendly, single operator can monitor and operate several machines
- High reliability, Low maintenance costs
Applications：
- Ceramic substrate cutting
- Ceramic VIA hole drilling
- Green tape high speed perforation (up to 400 holes per second)
- Heat sink substrate for LED
- Cutting of Substrate for hybrid devices
