We have developed a series of unique laser micromachining processes for fine cutting, optical wafer dicing, micro drilling and micro structuring.
These state of art technologies are especially suitable for processing hard to machine transparent materials, such as diamond, sapphire, strengthened glass, optical glass, quartz, silicon, ceramics, silicon nitrides and more.
Please note the examples below are compilation of some of our applications.
This is not the full scope of our job-shop services but a limited selection.
We micro process most hard and difficult to machine materials including most advanced optical materials.